Eight-layer board_Product Center_Guangdong Huizhi Technology Co., Ltd.

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Eight-layer board

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Eight-layer board

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FR-4

Board：FR-36

Hole copper thickness：≥20um

Table copper thickness：≥35um

Line width/gap：0.1mm/0.1mm

Minimum pore size：0.2mm

Solder resist color：white

Surface treatment：Lead-free spray tin

Special Process：Stamp holes are not allowed

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FR-4

Board：FR-35

Hole copper thickness：≥20um

Table copper thickness：≥35um

Line width/gap：0.1mm/0.1mm

Minimum pore size：0.2mm

Solder resist color：Matte black

Surface treatment：OSP

Special Process：Bevel edge

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FR-4

Board：FR-34

Hole copper thickness：≥20um

Table copper thickness：≥35um

Line width/gap：0.1mm/0.1mm

Minimum pore size：0.275mm

Solder resist color：green

Surface treatment：Lead-free spray tin

Special Process：Through hole plug hole, do not allow light

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FR-4

Board：FR-33

Hole copper thickness：≥20um

Table copper thickness：≥35um

Line width/gap：0.15mm/0.15mm

Minimum pore size：0.3mm

Solder resist color：green

Surface treatment：Lead-free spray tin

Special Process：Character color yellow

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