STRENGTH
Process capacity
Single-sided, double-sided, multi-layer, impedance, blind hole circuit boards and customized rapid prototypes with various specific requirements (can provide 24-hour expedited proofing, solve the production and development of difficult products, and provide technical support). Its products are widely used in communications High-tech fields such as telecommunications, power, energy, science and education institutions, automobiles, and optoelectronics are the best suppliers for electronics and related companies.
| project | routine | senior |
| Linewidth/ line to line | +/-20% | +/-10% |
| Via aperture | +/-0.003inch(0.075mm) | +/-0.002inch(0.050mm) |
| Non conducting aperture | +/-0.002inch(0.050mm) | +/-0.002inch(0.050mm) |
| Hole position | +/-0.003inch(0.075mm) | +/-0.002inch(0.050mm) |
| Hole to edge | +/-0.005inch(0.1 25mm) | +/-0.004inch(0.100mm) |
| Peripheral dimensions | +/-0.006inch(0.1 50mm) | +/-0.004inch(0.1mm) |
| Interlayer alignment | +/-0.005inch(0.125mm) | +/-0.005inch(0.125mm) |
| Impedance control | +/-10% | +/-7% |
| Plate music | Max.1.0% | Max.0.5% |
| capacity | routine | senior |
| Inner copper thickness | 10z ( 35um ) | 3Oz(105um) |
| Outer copper thickness | 1/3-20z(12-75um) | 3Oz(105um) |
| Minimum bore hole | 12mil(0.30mm) | 8mil(0.20mm) |
| Minimum line width / line to line | 4mil(0.10mm) | 3mil(0.075mm) |
| Maximum production panel | 21.5" X 24.5"(546mm X 622mm) |
| Surface treatment and coating | ||
| L ead tin sprayed ：40 to 1000 u in(1-25um) | ||
| Lead free tin spraying ：40 to 1000 u in(1-25um) | ||
| Antioxidant ：10 to 16 u in(0.25-0.4um) | ||
| Gold conversion ：1 to 5 u in(0.025-0.125um); Ni100 -250 u in(2.50-6.25um) | ||
| Tin precipitation ：32 to 48 u in(0.8- 1.2um) |
| PCB(Double Panel / multi-layer Panel ) | ||||
| NO. | Process | Item | Process capability | |
| 1 | Layer | Pressing plate | 1-12 floors | |
| 2 | Material | Material Type | FR4 | |
| 3 | Board thickness | Finished board thickness | 0.2-4.0mm | |
| 4 | Cutting | The Max panel size | 540 x 620mm | |
| 5 | Inner layer | Min.trace width /distance | 0.1 mm/0.1 mm | |
| Min.thickness of copper foil | 1/30Z-20Z | |||
| Inner alignment | ±0.05mm | |||
| Registration deviation | 0.025mm | |||
| Innerhole edge&margin line | 0.33mm | |||
| Inner layer copper-plate edge | 0.5mm | |||
| 6 | Drilling | Drill tip | 0.2mm-6.0mm | |
| The smallest aperture | 0.15mm | |||
| diameter tolerancePTH | ±0.05mm | |||
| diameter tolerance NPTH | ±0.025mm | |||
| Aspect ratio | 10:1 | |||
| 7 | Outer Layer | Min.trace width/gap | 0.76mm/0.76mm | |
| Bas copper thicknesse | 1/3oZ- 4oZ | |||
| Registration tolerance | ±0.05mm | |||
| Impedance control tolerance | ±10% | |||
| Line to line edge distance | 0.4mm | |||
| The Min distance from PTH cring to edge of line | 0.15mm/0.15mm | |||
| Line to line | 0.1mm | |||
| Line to PAD | 0.1mm | |||
| PAD to PAD PAD | 0.1mm | |||
| The distance from pantternedge to PCB outline | Routing | 0.2mm | ||
| Punching | 0.3mm | |||
| PCB(Double Panel / multi-layer Panel) | ||||
| NO. | Process | Item | Process capabillity | |
| 8 | Solder resist | Min. soldmask thickness(without special Req.) | 0.01mm | |
| The distance from pattern edge to soldmask opening | 0.01mm | |||
| Min.solder resistant bridge(green 0i |) | 0.01mm | |||
| Min.solder resistant opening | 0.08mm | |||
| Registration tolerance | ±0.05mm | |||
| Via hole plug capability | ≤0.6mm | |||
| 9 | Silkscreen | Min.silkscreen width | 0.13mm | |
| Min.silkscreen height | 0.8mm | |||
| 10 | Surface finished | OSP Thickness | 0.2-0.5um | |
| Immersion SN Thinckness | 0.8-1.0um | |||
| Immersion Silver Thinckness | 0.8-1.0um | |||
| PB free HAL Thinckness | ≥1.0um | |||
| Enig( without special Req.) | Authickness | 0.025-0.1um | ||
| Nithickness | 5um | |||
| 11 | Profilling | Min. slothole | 0.8mm | |
| Min. routing cut size | 0.8mm | |||
| Max routing cut size | 1.6mm | |||
| Contour tolerance | Routing | 0.15mm | ||
| Punching | 0.10mm | |||
| V-CUT angle tolerance V-CUT | ±5° | |||
| V-CUT core thickness V-CUT | ±0.5mm | |||
| Min V-CUT Size | 70×70mm | |||
| Min connector size after punching profile | 1.0mm | |||
| Min Punching slot | 1×2mm | |||
| Distance from Punching hole to Punching Slot | 0.6mm（Laminate thickness≤1.2mm ） | |||
| 1.6mm1.6mm | ||||
| 12 | Finished Board | Thickness tolerance | ±5° | |
| Wrapping tolerance | ≤5° | |||
PROFESSIONAL PCB MANUF ACTURER