STRENGTH
Process capacity
Single-sided, double-sided, multi-layer, impedance, blind hole circuit boards and customized rapid prototypes with various specific requirements (can provide 24-hour expedited proofing, solve the production and development of difficult products, and provide technical support). Its products are widely used in communications High-tech fields such as telecommunications, power, energy, science and education institutions, automobiles, and optoelectronics are the best suppliers for electronics and related companies.
project | routine | senior |
Linewidth/ line to line | +/-20% | +/-10% |
Via aperture | +/-0.003inch(0.075mm) | +/-0.002inch(0.050mm) |
Non conducting aperture | +/-0.002inch(0.050mm) | +/-0.002inch(0.050mm) |
Hole position | +/-0.003inch(0.075mm) | +/-0.002inch(0.050mm) |
Hole to edge | +/-0.005inch(0.1 25mm) | +/-0.004inch(0.100mm) |
Peripheral dimensions | +/-0.006inch(0.1 50mm) | +/-0.004inch(0.1mm) |
Interlayer alignment | +/-0.005inch(0.125mm) | +/-0.005inch(0.125mm) |
Impedance control | +/-10% | +/-7% |
Plate music | Max.1.0% | Max.0.5% |
capacity | routine | senior |
Inner copper thickness | 10z ( 35um ) | 3Oz(105um) |
Outer copper thickness | 1/3-20z(12-75um) | 3Oz(105um) |
Minimum bore hole | 12mil(0.30mm) | 8mil(0.20mm) |
Minimum line width / line to line | 4mil(0.10mm) | 3mil(0.075mm) |
Maximum production panel | 21.5" X 24.5"(546mm X 622mm) |
Surface treatment and coating | ||
L ead tin sprayed :40 to 1000 u in(1-25um) | ||
Lead free tin spraying :40 to 1000 u in(1-25um) | ||
Antioxidant :10 to 16 u in(0.25-0.4um) | ||
Gold conversion :1 to 5 u in(0.025-0.125um); Ni100 -250 u in(2.50-6.25um) | ||
Tin precipitation :32 to 48 u in(0.8- 1.2um) |
PCB(Double Panel / multi-layer Panel ) | ||||
NO. | Process | Item | Process capability | |
1 | Layer | Pressing plate | 1-12 floors | |
2 | Material | Material Type | FR4 | |
3 | Board thickness | Finished board thickness | 0.2-4.0mm | |
4 | Cutting | The Max panel size | 540 x 620mm | |
5 | Inner layer | Min.trace width /distance | 0.1 mm/0.1 mm | |
Min.thickness of copper foil | 1/30Z-20Z | |||
Inner alignment | ±0.05mm | |||
Registration deviation | 0.025mm | |||
Innerhole edge&margin line | 0.33mm | |||
Inner layer copper-plate edge | 0.5mm | |||
6 | Drilling | Drill tip | 0.2mm-6.0mm | |
The smallest aperture | 0.15mm | |||
diameter tolerancePTH | ±0.05mm | |||
diameter tolerance NPTH | ±0.025mm | |||
Aspect ratio | 10:1 | |||
7 | Outer Layer | Min.trace width/gap | 0.76mm/0.76mm | |
Bas copper thicknesse | 1/3oZ- 4oZ | |||
Registration tolerance | ±0.05mm | |||
Impedance control tolerance | ±10% | |||
Line to line edge distance | 0.4mm | |||
The Min distance from PTH cring to edge of line | 0.15mm/0.15mm | |||
Line to line | 0.1mm | |||
Line to PAD | 0.1mm | |||
PAD to PAD PAD | 0.1mm | |||
The distance from pantternedge to PCB outline | Routing | 0.2mm | ||
Punching | 0.3mm |
PCB(Double Panel / multi-layer Panel) | ||||
NO. | Process | Item | Process capabillity | |
8 | Solder resist | Min. soldmask thickness(without special Req.) | 0.01mm | |
The distance from pattern edge to soldmask opening | 0.01mm | |||
Min.solder resistant bridge(green 0i |) | 0.01mm | |||
Min.solder resistant opening | 0.08mm | |||
Registration tolerance | ±0.05mm | |||
Via hole plug capability | ≤0.6mm | |||
9 | Silkscreen | Min.silkscreen width | 0.13mm | |
Min.silkscreen height | 0.8mm | |||
10 | Surface finished | OSP Thickness | 0.2-0.5um | |
Immersion SN Thinckness | 0.8-1.0um | |||
Immersion Silver Thinckness | 0.8-1.0um | |||
PB free HAL Thinckness | ≥1.0um | |||
Enig( without special Req.) | Authickness | 0.025-0.1um | ||
Nithickness | 5um | |||
11 | Profilling | Min. slothole | 0.8mm | |
Min. routing cut size | 0.8mm | |||
Max routing cut size | 1.6mm | |||
Contour tolerance | Routing | 0.15mm | ||
Punching | 0.10mm | |||
V-CUT angle tolerance V-CUT | ±5° | |||
V-CUT core thickness V-CUT | ±0.5mm | |||
Min V-CUT Size | 70×70mm | |||
Min connector size after punching profile | 1.0mm | |||
Min Punching slot | 1×2mm | |||
Distance from Punching hole to Punching Slot | 0.6mm(Laminate thickness≤1.2mm ) | |||
1.6mm1.6mm | ||||
12 | Finished Board | Thickness tolerance | ±5° | |
Wrapping tolerance | ≤5° |
PROFESSIONAL PCB MANUF ACTURER