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ten-layer board

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ten-layer board

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FR-4

Board：FR-41

Hole copper thickness：≥25um

Table copper thickness：≥48um

Line width/gap：0.15mm/0.15mm

Minimum pore size：0.35mm

Solder resist color：Matte black

Surface treatment：Shen Jin

Special Process：18,000 electrical test points

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FR-4

Board：FR-40

Hole copper thickness：≥20um

Table copper thickness：≥35um

Line width/gap：≥35um

Minimum pore size：0.275mm

Solder resist color：yellow

Surface treatment：OSP

Special Process：BGA size 0.3mm, solder resist window opening 0.1mm

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FR-4

Board：FR-39

Hole copper thickness：≥20um

Table copper thickness：≥70um

Line width/gap：0.15mm/0.2mm

Minimum pore size：0.35mm

Solder resist color：green

Surface treatment：Lead-free spray tin

Special Process：Table copper copper thickness greater than 70um, finished line width 0.1 5mm

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FR-4

Board：FR-32

Hole copper thickness：≥20um

Table copper thickness：≥35um

Line width/gap：0.075mm/0.1mm

Minimum pore size：0.2mm

Solder resist color：blue

Surface treatment：Shen Jin

Special Process：Mechanical blind hole plate

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