four-layer board_Product Center_Guangdong Huizhi Technology Co., Ltd.

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four-layer board

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four-layer board

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FR-4

Board：FR-28

Hole copper thickness：≥25um

Table copper thickness：≥35um

Line width/gap：0.15mm/0.15mm

Minimum pore size：0.3mm

Solder resist color：green

Surface treatment：Shen Jin

Special Process：Carbon oil

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FR-4

Board：FR-27

Hole copper thickness：≥20um

Table copper thickness：≥35um

Line width/gap：0.1mm/0.1mm

Minimum pore size：0.2mm

Solder resist color：green

Surface treatment：Shen Jin

Special Process：BGA size 0.3MM, solder mask window 0.1MM

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FR-4

Board：FR-20

Hole copper thickness：≥20um

Table copper thickness：≥35um

Line width/gap：0.1mm/0.1mm

Minimum pore size：0.2mm

Solder resist color：blue

Surface treatment：Lead-free spray tin

Special Process：Soldering resistance window opening 0.1mm, window opening distance 0.1mm

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FR-4

Board：FR-18

Hole copper thickness：≥20um

Table copper thickness：≥35um

Line width/gap：0.1mm/0.1mm

Minimum pore size：0.2mm

Solder resist color：green

Surface treatment：Shen Jin

Special Process：Half Orifice

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