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FR-4
Board：FR-41
Hole copper thickness：≥25um
Table copper thickness：≥48um
Line width/gap：0.15mm/0.15mm
Minimum pore size：0.35mm
Solder resist color：Matte black
Surface treatment：Shen Jin
Special Process：18,000 electrical test points
FR-4
Board：FR-40
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：≥35um
Minimum pore size：0.275mm
Solder resist color：yellow
Surface treatment：OSP
Special Process：BGA size 0.3mm, solder resist window opening 0.1mm
FR-4
Board：FR-39
Hole copper thickness：≥20um
Table copper thickness：≥70um
Line width/gap：0.15mm/0.2mm
Minimum pore size：0.35mm
Solder resist color：green
Surface treatment：Lead-free spray tin
Special Process：Table copper copper thickness greater than 70um, finished line width 0.1 5mm
FR-4
Board：FR-38
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：0.2mm/0.189mm
Minimum pore size：0.35mm
Solder resist color：green
Surface treatment：Shen Xi
Special Process：Does not accept any surface repairs and solder mask wiping
FR-4
Board：FR-37
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：0.075mm/0.1mm
Minimum pore size：0.2mm
Solder resist color：blue
Surface treatment：Shen Jin
Special Process：Mechanical blind hole plate
FR-4
Board：FR-36
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：0.1mm/0.1mm
Minimum pore size：0.2mm
Solder resist color：white
Surface treatment：Lead-free spray tin
Special Process：Stamp holes are not allowed
FR-4
Board：FR-35
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：0.1mm/0.1mm
Minimum pore size：0.2mm
Solder resist color：Matte black
Surface treatment：OSP
Special Process：Bevel edge
FR-4
Board：FR-34
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：0.1mm/0.1mm
Minimum pore size：0.275mm
Solder resist color：green
Surface treatment：Lead-free spray tin
Special Process：Through hole plug hole, do not allow light
FR-4
Board：FR-33
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：0.15mm/0.15mm
Minimum pore size：0.3mm
Solder resist color：green
Surface treatment：Lead-free spray tin
Special Process：Character color yellow
FR-4
Board：FR-32
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：0.075mm/0.1mm
Minimum pore size：0.2mm
Solder resist color：blue
Surface treatment：Shen Jin
Special Process：Mechanical blind hole plate
FR-4
Board：FR-31
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：0.1mm/0.76mm
Minimum pore size：0.275mm
Solder resist color：blue
Surface treatment：Shen Jin
Special Process：Welding resistance window opening 0.1mm window opening distance 0.1mm
FR-4
Board：FR-30
Hole copper thickness：≥20um
Table copper thickness：≥35um
Line width/gap：0.1mm/0.1mm
Minimum pore size：0.2mm
Solder resist color：green
Surface treatment：Shen Jin
Special Process：Gold cover
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