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FR-4

    • Board : FR-40
    • Hole copper thickness : ≥20um
    • Table copper thickness : ≥35um
    • Line width/gap : ≥35um
    • Minimum pore size : 0.275mm
    • Solder resist color : yellow
    • Surface treatment : OSP
    • Special Process : BGA size 0.3mm, solder resist window opening 0.1mm
  • Product description
    Board:
    FR-40
    Hole copper thickness:
    ≥20um
    Table copper thickness:
    ≥35um
    Line width/gap:
    ≥35um
    Minimum pore size:
    0.275mm
    Solder resist color:
    yellow
    Surface treatment:
    OSP
    Special Process:
    BGA size 0.3mm, solder resist window opening 0.1mm

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