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FR-4

    • Board : FR-30
    • Hole copper thickness : ≥20um
    • Table copper thickness : ≥35um
    • Line width/gap : 0.1mm/0.1mm
    • Minimum pore size : 0.2mm
    • Solder resist color : green
    • Surface treatment : Shen Jin
    • Special Process : Gold cover
  • Product description
    Board:
    FR-30
    Hole copper thickness:
    ≥20um
    Table copper thickness:
    ≥35um
    Line width/gap:
    0.1mm/0.1mm
    Minimum pore size:
    0.2mm
    Solder resist color:
    green
    Surface treatment:
    Shen Jin
    Special Process:
    Gold cover

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