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FR-4

    • Board : FR-29
    • Hole copper thickness : ≥35um
    • Table copper thickness : ≥70um
    • Line width/gap : 0.15mm/0.175mm
    • Minimum pore size : 0.275mm
    • Solder resist color : blue
    • Surface treatment : Lead-free spray tin
    • Special Process : Table copper copper thickness greater than 70um
  • Product description
    Board:
    FR-29
    Hole copper thickness:
    ≥35um
    Table copper thickness:
    ≥70um
    Line width/gap:
    0.15mm/0.175mm
    Minimum pore size:
    0.275mm
    Solder resist color:
    blue
    Surface treatment:
    Lead-free spray tin
    Special Process:
    Table copper copper thickness greater than 70um

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