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FR-4

    • Board : FR-25
    • Hole copper thickness : ≥35um
    • Table copper thickness : ≥70um
    • Line width/gap : 0.175mm/0.175mm
    • Minimum pore size : 0.3mm
    • Solder resist color : green
    • Surface treatment : OSP
    • Special Process : Surface copper should be greater than 70um
  • Product description
    Board:
    FR-25
    Hole copper thickness:
    ≥35um
    Table copper thickness:
    ≥70um
    Line width/gap:
    0.175mm/0.175mm
    Minimum pore size:
    0.3mm
    Solder resist color:
    green
    Surface treatment:
    OSP
    Special Process:
    Surface copper should be greater than 70um

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